DI CINO, M.; LI, F. Flip Chip Die-to-Wafer Bonding Review: Gaps to High Volume Manufacturing. Semiconductor Science and Information Devices, [S. l.], v. 4, n. 1, p. 8–13, 2022. DOI: 10.30564/ssid.v4i1.4474. Disponível em: https://journals.bilpubgroup.com/index.php/ssid/article/view/4474. Acesso em: 27 apr. 2024.