TOTORICA, N.; LI, F. Signal and Power Integrity Challenges for High Density System-on-Package. Semiconductor Science and Information Devices, [S. l.], v. 4, n. 2, p. 1–9, 2022. DOI: 10.30564/ssid.v4i2.4475. Disponível em: https://journals.bilpubgroup.com/index.php/ssid/article/view/4475. Acesso em: 3 may. 2024.