Li, Feng, Department of Electrical and Computer Engineering, University of Idaho, Moscow, Idaho, 83844, USA
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Semiconductor Science and Information Devices Vol. 4 , Iss. 1 (April 2022) - Article
Flip Chip Die-to-Wafer Bonding Review: Gaps to High Volume Manufacturing
Abstract PDF -
Semiconductor Science and Information Devices Vol. 4 , Iss. 2 (October 2022) - Review
Signal and Power Integrity Challenges for High Density System-on-Package
Abstract PDF