Congratulations to Prof. Ahmed Saeed Hassanien for becoming the Editor-in-Chief of Semiconductor Science and Information Devices!
2023-04-28
Aims and Scope
Semiconductor Science and Information Devices
ISSN: 2661-3212 (Online)
Vol. 4 , Iss. 1 (April 2022)
Editorial
Articles
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Total Energy and Electronic States of CdSe Nanoparticles
1-7
Article ID: 4420 DOI：https://doi.org/10.30564/ssid.v4i1.4420
82 (Download)
Abstract:
The authors fulfilled calculations of the total energy and electronic states of CdnSen nanoparticle:“wurzite”, “sphalerite” and “rock-salt” types of the structure. It was shown that at n ≤ 72 the “rock-salt” type is the most favorable energetically. However the extrapolation of the behavior of the energy per Cd-Se atomic pair shows that for n... More
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Flip Chip Die-to-Wafer Bonding Review: Gaps to High Volume Manufacturing
8-13
Article ID: 4474 DOI：https://doi.org/10.30564/ssid.v4i1.4474
155 (Download)
Abstract:
Flip chip die-to-wafer bonding faces challenges for industry adoption due to a variety of technical gaps or process integration factors that are not fully developed to high volume manufacturing (HVM) maturity. In this paper,flip-chip and wire bonding are compared, then flip-chip bonding techniques are compared to examine advantages for scaling and speed. Specific recent... More
Review
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Apache Hadoop Architecture, Applications, and Hadoop Distributed File System
14-20
Article ID: 4619 DOI：https://doi.org/10.30564/ssid.v4i1.4619
144 (Download)
Abstract:
The data and internet are highly growing which causes problems in management of the big-data. For these kinds of problems, there are many software frameworks used to increase the performance of the distributed system. This software is used for the availability of large data storage. One of the most beneficial software frameworks used to utilize data in distributed systems is... More