View Vol. 4 ,  Iss. 1 (April 2022)

Semiconductor Science and Information Devices

ISSN: 2661-3212 (Online)

Vol. 4 , Iss. 1 (April 2022)



  • Total Energy and Electronic States of CdSe Nanoparticles

    Victor Zavodinsky, Olga Gorkusha, Alexander Kuzmenko

    Article ID: 4420    DOI:

    82  (Download)


    The authors fulfilled calculations of the total energy and electronic states of CdnSen nanoparticle:“wurzite”, “sphalerite” and “rock-salt” types of the structure. It was shown that at n ≤ 72 the “rock-salt” type is the most favorable energetically. However the extrapolation of the behavior of the energy per Cd-Se atomic pair shows that for n... More

  • Flip Chip Die-to-Wafer Bonding Review: Gaps to High Volume Manufacturing

    Mario Di Cino, Feng Li

    Article ID: 4474    DOI:

    155  (Download)


    Flip chip die-to-wafer bonding faces challenges for industry adoption due to a variety of technical gaps or process integration factors that are not fully developed to high volume manufacturing (HVM) maturity. In this paper,flip-chip and wire bonding are compared, then flip-chip bonding techniques are compared to examine advantages for scaling and speed. Specific recent... More