View Vol. 4 ,  Iss. 1 (April 2022)

Semiconductor Science and Information Devices

ISSN: 2661-3212 (Online)

Vol. 4 , Iss. 1 (April 2022)



  • Total Energy and Electronic States of CdSe Nanoparticles

    Victor Zavodinsky, Olga Gorkusha, Alexander Kuzmenko

    Article ID: 4420
    141  (Abstract) 43  (Download)

    The authors fulfilled calculations of the total energy and electronic states of CdnSen nanoparticle:“wurzite”, “sphalerite” and “rock-salt” types of the structure. It was shown that at n ≤ 72 the “rock-salt” type is the most favorable energetically. However the extrapolation of the behavior of the energy per Cd-Se atomic pair shows that for n...

  • Flip Chip Die-to-Wafer Bonding Review: Gaps to High Volume Manufacturing

    Mario Di Cino, Feng Li

    Article ID: 4474
    173  (Abstract) 70  (Download)

    Flip chip die-to-wafer bonding faces challenges for industry adoption due to a variety of technical gaps or process integration factors that are not fully developed to high volume manufacturing (HVM) maturity. In this paper,flip-chip and wire bonding are compared, then flip-chip bonding techniques are compared to examine advantages for scaling and speed. Specific recent...


  • Apache Hadoop Architecture, Applications, and Hadoop Distributed File System

    Pratit Raj Giri, Gajendra Sharma

    Article ID: 4619
    125  (Abstract) 35  (Download)

    The data and internet are highly growing which causes problems in management of the big-data. For these kinds of problems, there are many software frameworks used to increase the performance of the distributed system. This software is used for the availability of large data storage. One of the most beneficial software frameworks used to utilize data in distributed systems is...